Total Dielectric Isolation (TDI) of Fully Depleted Device Structures

Abstract

The aim of this program is to prepare, evaluate and optimise Total Dielectric Isolated (TDI) structures in order to develop the technology for the preparation of substrates for circuits which exhibit improved radiation tolerance. Successful experiments include the preparation of device worthy substrates in variously patterned wafers, identification of the microstructure of TDI wafers by cross-sectional transmission electron microscopy (XTEM) and the successful implementation of a new predictive software package (IRIS). In addition a new halogen lamp heated wafer holder (funded under another contract) has been commissioned and used to prepare substrates with pre-heating and background heating up to 680 degrees C.

Open PDF

Document Details

Document Type
Technical Report
Publication Date
Jul 01, 1990
Accession Number
ADA227994

Entities

People

  • Peter L. Hemment

Organizations

  • University of Surrey

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Cell Physiological Processes
  • Computer Simulations
  • Computers
  • Contracts
  • Electrical Engineering
  • Electron Microscopy
  • Engineering
  • Fabrication
  • High Temperature
  • Implantation
  • Ion Implantation
  • Materials
  • Materials Science
  • Microscopy
  • Radiation
  • Simulations
  • Standards

Readers

  • Integrated Circuit Design and Technology.
  • Polymer Science and Technology
  • Thin Film Deposition Science.

Technology Areas

  • Microelectronics
  • Microelectronics - Graphene