The Investigation and Production of Titanium-Tantalum Junctions Diffusion Bonded at High Temperature (855C to 920C): the Influence of Temperature, Time Pressure and Roughness on the Mechanical Properties, and the Optimisation of the Bonded Conditions
Abstract
This investigation shows that, despite a clear Kirkendall effect, it is possible within the technical constraints to find a combination of the four main operating parameters (temperature, time, pressure and roughness) allowing the successful diffusion bonding of titanium and tantalum (with fracture of the tensile test specimens occurring in the tantalum at 360 MPa). The optimum temperature range at low pressure (2 to 5 MPa) lies in the alpha phase of titanium at 875 to 885 deg C. The pressure, which plays a decisive role in the resorption kinetics of residual defects, must be greater than 2 MPa to ensure the production of strong and ductile junctions in a reasonable time. The application of a temporary overpressure during heating offers many advantages, such as limited deformation of test pieces, saving of time, the production of better quality junctions, and even the bonding of surfaces with significant roughness. (TTL)
Document Details
- Document Type
- Technical Report
- Publication Date
- Jan 01, 1990
- Accession Number
- ADA228217
Entities
People
- B. Hocheid
- M. Hourcade
- M. Veyrac
- S. Pineau
Organizations
- Royal Aircraft Establishment