Fundamental Studies of Electronic Packaging Materials and Structures: Surface and Interfaces

Abstract

Layered structures consisting of metals, ceramics and polymers are used extensively for signal and power distribution both at the chip level and in electronic packages. The structural integrity of the interfaces between layers in such structures is an important consideration in the design and fabrication of a variety of devices and components. Various variables including surface composition and structure that control interfacial adhesion are investigated. Interfaces between metal/ceramic, metal/polymer and between polymer/polymer are studied in the research reported.

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Document Details

Document Type
Technical Report
Publication Date
Dec 12, 1990
Accession Number
ADA232336

Entities

People

  • A. L. Ruoff
  • C-y. Li
  • C. B. Carter
  • D. L. Kohlstedt
  • E. J. Kramer

Organizations

  • Cornell University

Tags

Communities of Interest

  • Advanced Electronics
  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Biomedical And Dental Materials
  • Block Copolymers
  • Ceramic Materials
  • Chemistry
  • Composite Materials
  • Crystal Structure
  • Films
  • Free Energy
  • Materials
  • Materials Processing
  • Materials Science
  • Military Research
  • Oxides
  • Polymeric Films
  • Stresses
  • Thermal Stresses
  • Thin Films

Readers

  • Polymer Science and Technology
  • Software Engineering
  • Thin Film Deposition Science.

Technology Areas

  • Microelectronics