Investigation of Polybenzocyclobutene Resins in Multilayer Thin Films for Electronic Packaging

Abstract

Polybenzocyclobutene dielectric films were found to exhibit significant advantages compared to polyimides for multichip multilayer packaging applications. Although PBCB films must be cured in an oxygen-free environment and are somewhat more sensitive to warpage/stress than polyimides, they are significantly superior with respect to moisture resistance, lower dielectric constant and leveling or planarization over rough surface topography. The adhesion of PBCB films to copper, aluminum and silicon without adhesion promoters is excellent. Tests to date with PBCB as a multilevel dielectric with both a counter/decoder circuit and an analog circuit, in conjunction with via post interconnects, reveal the potential for the reliable fabrication of high speed and high density multichip/multilayer modules.

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Document Details

Document Type
Technical Report
Publication Date
Feb 01, 1991
Accession Number
ADA235223

Entities

People

  • J. W. Peters
  • S. O. Fong

Organizations

  • Wright Laboratory

Tags

DTIC Thesaurus Topics

  • Air Force
  • Composite Materials
  • Dielectric Films
  • Dielectrics
  • Electrical Properties
  • Materials
  • Materials Laboratories
  • Materials Processing
  • Materials Testing
  • Measurement
  • Mechanical Properties
  • Metal Films
  • Procurement
  • Resins
  • Thin Films
  • Transmission Lines
  • Wave Propagation

Readers

  • Integrated Circuit Design and Technology.
  • Nanofabrication and Microfabrication.
  • Polymer Science and Engineering.

Technology Areas

  • Microelectronics
  • Microelectronics - Graphene