A Computational and Experimental Study of Flush Heat Sources in Liquids

Abstract

A numerical investigation of two-dimensional natural convection flow and heat transfer from a substrate-mounted flush heat source immersed in a liquid-filled square enclosure was conducted. The study is relevant to direct liquid-immersion cooling of electronic-components. A control volume based finite-difference model that accounts for conduction heat transfer within the substrate and heat source and the coupled natural convection in the fluid was utilized. Numerical predictions were obtained for a wide range of Rayleigh and Prandtl numbers, substrate to fluid and heat source to fluid thermal conductivity ratios and other geometrical parameters that may be encountered in practice. An increase in Rayleigh number lead to more vigorous flow and promoted cooling. No noticeable effect on the nondimensional temperature was observed when changing the Prandt number from 7 to 100. Little reduction in maximum temperatures was observed when substrate and component to fluid thermal conductivity ratios were increased beyond 10 and 25, respectively. Component to substrate width ratio change from .25 to .999 resulted in approximately linear decrease in the maximum temperature. A companion experimental study of three- dimensional natural convection transport from a flush mounted array of heat sources in water was also conducted. Computer temperatures compared favorably to appropriate experimental data.

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Document Details

Document Type
Technical Report
Publication Date
Jun 01, 1990
Accession Number
ADA236836

Entities

People

  • Larry O. Haukenes

Organizations

  • Naval Postgraduate School

Tags

Communities of Interest

  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Boundary Layer
  • Computer Programs
  • Convection
  • Department Of Defense
  • Electronic Components
  • Electronic Equipment
  • Engineering
  • Fluid Flow
  • Heat Transfer
  • Heat Transfer Coefficients
  • Mechanical Engineering
  • Prandtl Number
  • Steady State
  • Thermal Conductivity
  • Thermophysical Properties
  • Three Dimensional
  • Two Dimensional

Readers

  • Combustion and Flow Dynamics.
  • Fluid Dynamics.
  • Thermal Physics or Thermal Science.

Technology Areas

  • Microelectronics