Silicon Wafer Advanced Packaging (SWAP). Multichip Module (MCM) Foundry Study. Version 2

Abstract

MCM technology is crucial to maintaining the competitive position of the U.S. electronics industry - military and commercial. The driving force is performance, and MCM users will seek off-shore suppliers if capabilities are lacking. In the long term, low-cost overseas capabilities will make their way into the U.S. military market and put it at risk. The proven GE-HDI MCM technology was developed with combined government and Ge funding, and its chips first approach offers the lowest non-recurring cost. Rapid prototyping, high performance, and technology flexibility are characteristic, and the potential exists for extension to high-volume.

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Document Details

Document Type
Technical Report
Publication Date
Apr 08, 1991
Accession Number
ADA237412

Entities

People

  • Frank Henry
  • Larry Mowatt
  • Mark Avery
  • Mark Eskew
  • Porter Sadler

Organizations

  • Texas Instruments

Tags

Communities of Interest

  • Advanced Electronics
  • Energy and Power Technologies
  • Ground and Sea Platforms
  • Human Systems
  • Space
  • Weapons Technologies

DTIC Thesaurus Topics

  • Circuit Analysis
  • Computer Programming
  • Computer Programs
  • Computers
  • Databases
  • Electronics Industry
  • Engineers
  • Failure Mode And Effect Analysis
  • Materials Laboratories
  • Materials Processing
  • Materials Science
  • Materials Testing
  • Performance Tests
  • Semiconductor Manufacturing
  • Semiconductors
  • Test And Evaluation
  • Test Methods

Readers

  • Industrial Economics
  • Integrated Circuit Design and Technology.
  • Systems Analysis and Design

Technology Areas

  • Microelectronics