The Growth of Ultrathin Epitaxial Intermetallic Films

Abstract

The growth of iron aluminide and NiAl intermetallic compounds on III-V substrates has been studied using reflection high-energy electron diffraction (RHEED), transmission electron diffraction (TEM), and selected area electron channeling patterns (SAECP). Procedures for the growth of both of these intermetallics with layer-by-layer control were developed. The quality of the films on indium phosphides (100) substrates exceeds those grown on gallium arsenides (100) substrates due to the lower lattice mismatch. The films are stable to at least 820K. TEM measurements indicate that the burgers vector of misfit dislocations is a complete a(100). SACP, TEM, and TEM indicate that the film relaxation approximates the Matthews Blakeslee prediction. Even this was surprising in light of the layer by layer growth after relaxation since the type of dislocation that forms cannot glide to the interface to relieve the strain. Preliminary semiconductor - intermetallic - semiconductor structures have been grown. The quality of the interfaces is being assessed.

Open PDF

Document Details

Document Type
Technical Report
Publication Date
Feb 11, 1991
Accession Number
ADA237798

Entities

People

  • P. I. Cohen

Organizations

  • University of Minnesota

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Aluminides
  • Chemistry
  • Compound Semiconductors
  • Crystal Lattices
  • Diffraction
  • Electrical Engineering
  • Electron Diffraction
  • Electron Microscopes
  • Engineering
  • Epitaxial Growth
  • Films
  • Iron Aluminide
  • Materials
  • Materials Science
  • Metals
  • Semiconductors
  • Students

Fields of Study

  • Materials science

Readers

  • Powder metallurgy of Titanium alloys.
  • Semiconductor Device Technology
  • Thin Film Deposition Science.

Technology Areas

  • Microelectronics
  • Microelectronics - Graphene