Properties and Adhesion of Polyimides in Microelectronic Devices

Abstract

This paper gives a summary on the properties of polyimide films used in microelectronic devices and on recent research efforts to understand the adhesion between polyimides and inorganic materials. One of the major concerns in the application of polyimides is the integrity and reliability of the laminar structures. Surface sensitive spectroscopies have been recently applied to identify the nature of the chemical bond for metals evaporated onto cured polyimide surfaces and for spun-on and subsequently imidized polyamic acid films on metal surfaces. Depending on the preparation of the interface, e.g. metal on polymer or polymer on bulk metal, different phenomena are observed.

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Document Details

Document Type
Technical Report
Publication Date
May 15, 1991
Accession Number
ADA238204

Entities

People

  • M. Grunze

Organizations

  • University of Maine

Tags

Communities of Interest

  • Advanced Electronics
  • C4I
  • Weapons Technologies

DTIC Thesaurus Topics

  • Adhesion
  • Advanced Materials
  • Chemical Bonds
  • Chemistry
  • Civil Engineering
  • Corrosion Resistant Steels
  • Engineering
  • Inorganic Materials
  • Insensitive Explosives
  • Materials
  • Materials Science
  • Military Research
  • Plastic Explosives
  • Reliability
  • Spectroscopy
  • Systems Engineering
  • Technical Information Centers

Readers

  • Polymer Science and Engineering.
  • Thin Film Deposition Science.

Technology Areas

  • Microelectronics
  • Microelectronics - Graphene