New Ultra Low Permittivity Composites for Use in Ceramic Packaging of Ga:As Integrated Circuits

Abstract

This report documents the work that has been conducted at the Materials Research Laboratory (MRL), The Pennsylvania State University and Interamics in La Jolla, California, for the low permittivity project. The emphasis was on developing ultralow permittivity (K) substrate materials. Sol gel and reactive sputter deposited substrates were selected for further development into a viable substrate. Currently emphasis has shifted from development of ultra-low permittivity materials to putting down metallization on these low K substrates. Thus progress is being made in the direction of a prototype package which would utilize these substrates. This report starts off with the work done on the development of low K substrates and then moves on to the efforts on putting down metal traces and forming vias.

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Document Details

Document Type
Technical Report
Publication Date
Jul 12, 1991
Accession Number
ADA238704

Entities

People

  • Leslie Eric Cross

Organizations

  • Pennsylvania State University

Tags

DTIC Thesaurus Topics

  • Chemical Synthesis
  • Chemistry
  • Coatings
  • Dielectric Permittivity
  • Dielectric Polymers
  • Dielectric Properties
  • Fabrication
  • Frit
  • Geometry
  • Glass
  • Hydroxides
  • Macromolecules
  • Materials
  • Materials Laboratories
  • Materials Processing
  • Materials Science
  • Thermal Conductivity

Fields of Study

  • Materials science

Readers

  • Integrated Circuit Design and Technology.
  • Nanofabrication and Microfabrication.
  • Technical Research and Report Writing.