A Spectroscopic Immersion Ellipsometry Study of the Mechanism of Si/SiO2 Interface Annealing

Abstract

In this study we apply an interface sensitive ellipsometry technique to study the evolution of the Si-SiO, interface as a function of high temperature annealing (750-1100C). Essentially, the ellipsometry technique embodies the use of liquids that refractive index match with the bulk film thereby removing the optical response of the overlayer and greatly enhancing sensitivity to the interface. According to both time and temperature of anneal, distinct modes of behavior are observed for the evolution of the interface. For short anneal times a rapid change in the interface is observed that correlates with the disappearance of protrusions, followed by a slower change that correlates with the disappearance of the suboxide. At high temperatures viscous relaxation dominates while at low temperatures the suboxide reduction is apparent. A model for the interface in terms of chemical and physical interface processes is proposed and model parameters are compared with literature results.

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Document Details

Document Type
Technical Report
Publication Date
Nov 01, 1991
Accession Number
ADA242831

Entities

People

  • Eugene A. Irene
  • Qingcao Liu
  • V. A. Yakovlev

Organizations

  • University of North Carolina at Chapel Hill

Tags

Communities of Interest

  • Advanced Electronics
  • Materials and Manufacturing Processes

DTIC Thesaurus Topics

  • Angle Of Incidence
  • Chemical Compounds
  • Chemical Reaction Properties
  • Chemical Reactions
  • Chemistry
  • Decomposition
  • Geometry
  • High Temperature
  • Low Temperature
  • North Carolina
  • Numbers
  • Oxidation
  • Oxides
  • Reaction Mechanisms
  • Refractive Index
  • Relaxation Time
  • Viscous Flow

Fields of Study

  • Physics

Readers

  • Atmospheric Science / Meteorology, specifically Wind Wave Turbulence.
  • Nanofabrication and Microfabrication.
  • Nanoscale Plasmonic Nanotechnology