Strength and Microstructure of Ceramics.

Abstract

Results of a program on the toughness properties of monophase and two phase ceramics that toughen by bridging are presented. Fracture mechanics models describing this behavior, in the particular context of strength, are developed. Results of strengths tests confirming the essential predictions of the theory are presented. Innovative processing routes suggested by the models are shown to lead to two phase composites with impressive flaw insensitivity. A partial list of publications included in this report are: (1) The role of crystallization of an intergranular glassy phase in determining grain boundary residual stresses in debased aluminas; (2) In situ measurements of bridged crack interfaces in scanning electron microscopes; (3) Cyclic fatigue from frictional degradation at bridging grains in alumina; (4) Microstructure, toughness curves and mechanical properties of alumina ceramics; (5) Fabrication of flaw tolerant aluminum titanate reinforced alumina; and (6) Influence of grain size and degree of crystallization of intergranular glassy phase on the mechanical behaviour of a debased alumina.

Open PDF

Document Details

Document Type
Technical Report
Publication Date
Oct 01, 1991
Accession Number
ADA243049

Entities

People

  • Brian R. Lawn

Organizations

  • National Institute of Standards and Technology

Tags

Communities of Interest

  • Advanced Electronics
  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Ceramic Materials
  • Ceramic Matrix Composites
  • Composite Materials
  • Failure Mode And Effect Analysis
  • Material Degradation Processes
  • Materials
  • Materials Engineering
  • Materials Laboratories
  • Materials Processing
  • Materials Science
  • Materials Testing
  • Mechanical Properties
  • Mechanical Working
  • Mechanics
  • Modulus Of Elasticity
  • Structural Ceramics
  • Technical Ceramics

Fields of Study

  • Materials science

Readers

  • Materials Science and Engineering.
  • Reinforced Composite Materials
  • Theoretical Analysis.

Technology Areas

  • Microelectronics