Computer Aided Thermal Analysis of a Microcircuit Structure

Abstract

The Naval Post Graduate School has obtained software which can be used for the thermal analysis of an electronic component. This software includes two versions, one for steady state analysis and the other for transient analysis. Each version consists of two programs, a model builder and a thermal analyzer. This thesis describes a user friendly, menu driven specific model builder which may be used to rapidly generate a thermal model, containing up to 750 nodes, for a microcircuit die. This model builder is an improvement over the existing model builder in that the only pertinent input will be the physical dimensions and heat transfer data. The main feature of this model builder is the accommodation of the marked variation of silicon thermal conductivity with temperature.

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Document Details

Document Type
Technical Report
Publication Date
Dec 01, 1990
Accession Number
ADA243160

Entities

People

  • Joseph A. Willhelm Jr

Organizations

  • Naval Postgraduate School

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Air Gaps
  • Circuits
  • Data Sets
  • Differential Equations
  • Electrical Engineering
  • Electronic Circuits
  • Electronic Components
  • Electronic Equipment
  • Energy
  • Heat Transfer
  • Heat Transmission
  • Steady State
  • Temperature Gradients
  • Thermal Analysis
  • Thermal Conductivity
  • Thermal Resistance
  • User Friendly

Readers

  • Computer Science.
  • Fluid Dynamics.
  • Integrated Circuit Design and Technology.

Technology Areas

  • Microelectronics
  • Microelectronics - Microelectromechanical Systems