Scanning Electron Microscopy of the Effects of Moisture and Elevated Temperature on the Fibre/Matrix Bond in CFRP

Abstract

The engineering properties of carbon fibre reinforced plastics (CFRPs) make them attractive materials with potential applications in many demanding markets. Because of their low density, CFRPs have high specific strength and stiffness thus offering substantial savings in weight. For these reasons, composites such as carbon fibre reinforced epoxy resins are increasingly being used in aircraft primary and secondary structures. Unlike metals however, epoxy resins are moisture-sensitive and absorbed moisture can affect the properties of the composite as a whole. Today's military aircraft can also experience rapid high temperature excursions called 'thermal spikes' caused by air friction during supersonic flight or ground-reflected efflux from the engines of VTOL aircraft. Recent work suggests that not only is the resin matrix degraded by absorbed moisture, but also that the fibre/resin bond is itself degraded. This Memorandum describes an investigation using scanning electron microscopy (SEM) techniques to examine the fibre/resin interface for signs of degradation due to prolonged exposure to high humidity and thermal spiking.

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Document Details

Document Type
Technical Report
Publication Date
Aug 01, 1991
Accession Number
ADA243248

Entities

People

  • G. D. Howard

Organizations

  • Royal Aircraft Establishment

Tags

Communities of Interest

  • Air Platforms

DTIC Thesaurus Topics

  • Carbon Fiber Reinforced Polymer
  • Carbon Fibers
  • Climate
  • Electron Microscopes
  • Electron Microscopy
  • Environment
  • Epoxy Resins
  • Fiber Reinforced Polymers
  • Materials
  • Mechanical Properties
  • Microscopes
  • Microscopy
  • Plastics
  • Reinforced Plastics
  • Resins
  • Scanning Electron Microscopes
  • Scanning Electron Microscopy

Fields of Study

  • Materials science

Readers

  • Reinforced Composite Materials
  • Thermal Physics or Thermal Science.

Technology Areas

  • Hypersonics
  • Microelectronics