Dynamic Behavior of Ceramic Composites

Abstract

Results obtained from our studies on the toughening mechanism, quantitative fractography and dynamic fracture of ceramics and ceramic matrix composites are summarized in this final report. One of the most significant accomplishments was to quantify, for the first time, the energy dissipation rate in the brittle silicon carbon(sub w)/aluminum oxide ceramic matrix composite (CMC) using moire interferometry together with finite element analysis. The same hybrid experimental-numerical analysis was also used to determine the resistance curve, which compared favorably with the theoretically predicted toughening effect, in titanium boride. A procedure for estimating the percentage areas of transgranular fracture in ceramics and CMC using line scanning profiles of scanning electron microscopy was developed. Larger percentage areas, which were determined by this procedure of transgranular fractures in Al2O3 and SiC(sub w)/ Al2O3, were related to rapid crack propagation thus suggesting a micromechanism which reduces the dynamic crack arrest capability of brittle material. A unique bar impact test was developed for clean dynamic fracture testing of ceramics and CMC's and was used to characterize the dynamic fracture responses of Al2O3 and SiC(sub w)/Al2O3.

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Document Details

Document Type
Technical Report
Publication Date
Oct 01, 1991
Accession Number
ADA243904

Entities

People

  • Albert S. Kobayashi
  • M. Taya

Organizations

  • University of Washington

Tags

Communities of Interest

  • Air Platforms
  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Aluminum Oxides
  • Ceramic Matrix Composites
  • Composite Materials
  • Crack Propagation
  • Cracks
  • Electron Microscopy
  • Engineering
  • Finite Element Analysis
  • Fracture (Mechanics)
  • Line Scanning
  • Materials
  • Mechanical Properties
  • Mechanics
  • Resistance
  • Scanning Electron Microscopy
  • Stress Intensity Factors
  • Stresses

Fields of Study

  • Materials science

Readers

  • Materials Science (Mechanical Engineering).
  • Reinforced Composite Materials
  • Thin Film Deposition Science.

Technology Areas

  • Microelectronics