A Study of the Microstructural Basis for the Strength and Toughness Properties of As-Quenched and Quenched and Tempered High Copper HSLA-100 Steel

Abstract

This report discusses a program for the use of high copper HSLA-100 steel as a replacement for HY-130 in ship construction. The characterization of the microstructure of this highly weldable high copper HSLA-100 steel is extremely important to this program. In the present work, optical, scanning, scanning electron and transmission electron microscopy were employed to analyze and characterize the microstructural basis for the mechanical properties off as- quenched and quenched and tempered high copper HSLA-100 steel in form of 19.05 mm plate. The as-quenched and samples aged at 538 C and 621 C were examined in great detail. In the as-quenched condition the microstructure consisted of small packets of highly dislocated lath martensite containing autotempered iron carbides with small amounts of retained austenite present as thin films (200-300 A in width) at lath boundaries. The best combination of strength and toughness occurred in the sample aged at 538 C. Contributing to these desirable characteristics was the recovery of the dislocation substructures, the precipitation of coherent BCC copper precipitates (12-20 A in size) further precipitation (FeM)3C.

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Document Details

Document Type
Technical Report
Publication Date
Dec 01, 1991
Accession Number
ADA245151

Entities

People

  • Harvey A. Winters

Organizations

  • Naval Postgraduate School

Tags

Communities of Interest

  • Ground and Sea Platforms

DTIC Thesaurus Topics

  • Alloys
  • Construction
  • Crystal Structure
  • Electron Microscopes
  • Electron Microscopy
  • Fabrication
  • Hardness
  • Materials
  • Mechanical Properties
  • Mechanics
  • Microscopy
  • Navy
  • Solid Solutions
  • Tensile Strength
  • Transition Temperature
  • Transmission Electron Microscopy
  • United States

Fields of Study

  • Materials science

Readers

  • Auditory Neuroscience/Auditory Physiology.
  • Materials Science and Engineering.
  • Powder metallurgy of Titanium alloys.

Technology Areas

  • Microelectronics