The Electronic Evaluation of the Advanced Dynamic Anthropomorphic Manikin (ADAM) in High Temperature Environments

Abstract

From the results of the 987 tests, it is concluded that the ADAM may have difficulty operating in high ambient temperatures above 160 F. The tests described in this report were used to determine probable causes of manikin shutdown at temperatures above this range. The safe viscera operational temperature threshold was determined to be 180 F. This correlates to a safe ambient operations temperature threshold of 130 F with a worst case manikin set up. To determine when the ADAM shut down above this temperature, manikin internal load cells, potentiometers, and accelerometers were excited and monitored external to the manikin. Additionally, circuit board voltages were externally monitored to determine when and which circuit boards shut down during a test. Finally, data were collected from the ADAM periodically to monitor the operational status of the manikin and any effect the temperatures were having on the sensors and data acquisition system of the manikin. The temperature profiles selected were representative of the operational temperatures the ADAM will experience in the F-16 cockpit mockup on the Multi-Axis Seat Ejection (MASE) sled at Holloman AFB, NM, where the ADAM will be used for Air Force ejection tests in the near future.

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Document Details

Document Type
Technical Report
Publication Date
Mar 01, 1991
Accession Number
ADA245459

Entities

People

  • Eric K. Spittle
  • Ints Kaleps
  • Roy R. Rasmussen

Organizations

  • Armstrong Laboratory

Tags

Communities of Interest

  • Energy and Power Technologies
  • Sensors

DTIC Thesaurus Topics

  • Accelerometers
  • Central Processing Units
  • Circuit Boards
  • Computers
  • Data Acquisition
  • Environment
  • High Temperature
  • Humidity
  • Instrumentation
  • Load Cells
  • Low Humidity
  • Low Temperature
  • Measurement
  • Plastic Explosives
  • Temperature Gradients
  • Test And Evaluation
  • Wet Bulb Temperature

Readers

  • Explosive Engineering.
  • Thermal Physics or Thermal Science.

Technology Areas

  • Microelectronics
  • Microelectronics - Microelectromechanical Systems