Adsorption and Decomposition of Trimethyl Indium on Si(111)-7x7 Studied with XPS, UPS and HREELS

Abstract

The techniques of x ray photoemission spectroscopy, UPS or ultraviolet photoemission spectroscopy, and HREELS or high resolution electron energy loss spectroscopy are utilized to investigate the thermal decomposition of trimethyl indium (TMIn) on Si(111)-7x7. When dosed at 120 K, TMIn was primarily molecularly adsorbed on hte surface with a minor splitting of CH3 groups from the central in atom. Upon annealing the sample at 280 K, partial desorption of TMIn was accompanied by further dissociation of the In-C bonds; Annealing the surface from 540 to 620 K caused complete cracking of the In-C bonds, simultaneously a new peak at 128 meV was observed in HREELS, which is assigned to the CH3 groups attached to the surface. At 620 K and above, the SiH species was evident in both UPS and HREELS, indicating the onset of CH bond cracking; meanwhile the atomic In started to desorb. These processes continued as the sample was further annealed up to 790 K. finally at T greater than 950 K, SiC was formed after the complete cracking of CH bonds and the desorption of In and H species.

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Document Details

Document Type
Technical Report
Publication Date
Jan 01, 1991
Accession Number
ADA246261

Entities

People

  • Jason C. Chu
  • Lin Ming-chang
  • Yue Bu

Organizations

  • Emory University

Tags

Communities of Interest

  • Advanced Electronics
  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Adsorption
  • Annealing
  • Attenuation
  • Chemistry
  • Compound Semiconductors
  • Crystal Growth
  • Crystals
  • Decomposition
  • Desorption
  • Dissociation
  • Electron Energy
  • Ionization
  • Raman Spectra
  • Semiconductors
  • Silicon Carbide
  • Spectra
  • Spectroscopy

Readers

  • Combustion science or combustion engineering.
  • Organic Chemistry
  • Thin Film Deposition Science.

Technology Areas

  • Microelectronics
  • Microelectronics - Graphene