Studies of Intermetallic Growth in Cu-SOLDER Systems and Wettability at Solid-Liquid Interfaces

Abstract

The metallurgical bond formed between tin-lead solder and the copper substrate is characterized by the formation of an intermetallic layer. The growth of the intermetallic layer is the result of competing mechanisms, growth of the intermetallic at the intermetallic copper interface and its dissolution at the intermetallic liquid solder interface. These were studied by determining the dissolution rates of the copper and the intermetallic compound. An experimental apparatus for the immersion emersion tensiometric method, which can be used to determine immersion and emersion contact angles and surface tension, was set up and tested. This technique offers several advantages over the conventional sessile drop and tensiometric methods, and can be utilized to study wettability at solid-liquid interfaces.

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Document Details

Document Type
Technical Report
Publication Date
Sep 01, 1991
Accession Number
ADA246836

Entities

People

  • Raymond W. Martin

Organizations

  • Naval Postgraduate School

Tags

Communities of Interest

  • Advanced Electronics
  • Air Platforms
  • Weapons Technologies

DTIC Thesaurus Topics

  • Alloys
  • Chemistry
  • Copper
  • Electron Microscopy
  • Engineering
  • High Temperature
  • Intermetallic Compounds
  • Materials
  • Materials Science
  • Measurement
  • Mechanical Engineering
  • Mechanical Properties
  • Physical Properties
  • Security
  • Substrates
  • Surface Tension
  • United States

Fields of Study

  • Materials science

Readers

  • Surface Engineering/Surface Coating Technology.