Calculation of Chip Temperatures Using ELLPACK

Abstract

In this thesis we report on an experiment to solve a three dimensional elliptic problem using ELLPACK software. The physical problem arises when calculating the distribution of temperatures within an electronic package in order to assist in the design of appropriate cooling. ELLPACK software is modified here to solve three dimensional problems more general than the ones it was originally designed for.

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Document Details

Document Type
Technical Report
Publication Date
Jun 01, 1991
Accession Number
ADA247156

Entities

People

  • Vincent J. Van Joolen

Organizations

  • Naval Postgraduate School

Tags

Communities of Interest

  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Applied Mathematics
  • Boundaries
  • Classification
  • Coefficients
  • Computers
  • Difference Equations
  • Differential Equations
  • Equations
  • Geometry
  • Heat Transfer
  • Materials
  • Mathematical Models
  • Mathematics
  • Partial Differential Equations
  • Thermal Conductivity
  • Three Dimensional
  • Two Dimensional

Fields of Study

  • Engineering

Readers

  • Calculus or Mathematical Analysis
  • Computational Fluid Dynamics (CFD)
  • Software Engineering

Technology Areas

  • Microelectronics
  • Microelectronics - Microelectromechanical Systems