Residual Thermal Stresses in Graphite/PEEK (APC-2) Laminates

Abstract

Thermoplastic resin composites undergo a substantial temperature drop during their post-manufacturing cool-down and sustain substantial residual stresses due to mutual geometric constraints among the multi-directional plies. In view of the time-dependent thermomechanical response of the resin the residual stresses exhibit strong dependence on cool-down history. This paper demonstrates that it is possible to obtain an optimal cool-down path which minimizes the residual thermal stresses in APC-2 composites.

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Document Details

Document Type
Technical Report
Publication Date
Sep 12, 1991
Accession Number
ADA247450

Entities

People

  • K. Lee
  • Y. J. Weitsman

Organizations

  • University of Tennessee

Tags

DTIC Thesaurus Topics

  • Classification
  • Composite Materials
  • Creep
  • Engineering
  • Epoxy Composites
  • Equations
  • Graphitic Materials
  • Laminates
  • Materials
  • Materials Science
  • Mechanics
  • Residual Stress
  • Security
  • Stresses
  • Thermal Stresses
  • Time Intervals
  • Universities

Fields of Study

  • Materials science

Readers

  • Adaptive Control and Estimation with Uncertainty in Dynamic Systems.
  • Mechanical Engineering/Mechanics of Materials.
  • Reinforced Composite Materials