Mechanics of Thin Films
Abstract
Problems in the mechanics and thermomechanics of thin films have been addressed. Anisotropic stresses in films of cubic anisotropy oriented along the <100>, <111>, or <110> normals on a substrate; Relaxation in thin films by time- independent plastic deformation along the film substrate interface, by cracking, or by stress-induced diffusional flow during film growth. The toughening effect on brittle components of thin films in residual compression has been calculated and compared to experimental data. Motivated by measurements (using the thermal comparator technique) of thin film thermal conductivity where the film conductivity was found to be up to two orders of magnitude lower than that of the corresponding solid, the thermal conductivity of thin dielectric films has been correlated to microstructural features such as grain size and film thickness. The implications of reduced film thermal conductivity were examined for laser damage where nonlinear effects were shown to be important. The effects of film anisotropy and interfacial thermal resistance have been analyzed and the contribution of microporosity to interfacial thermal resistance has been calculated. For thermally anisotropic films an equivalent isotropic film of properly chosen thickness and conductivity could be identified. Length scales have been established against which the film thickness is to be compared.
Document Details
- Document Type
- Technical Report
- Publication Date
- Feb 06, 1992
- Accession Number
- ADA247848
Entities
People
- John C. Lambropoulos
Organizations
- University of Rochester