The Prediction of the Performance of a Microcircuit Heat Sink in the Boiling Mode
Abstract
As microcircuit technology advances, there is an increased need for the dissipation of the heat which is generated. Extended surfaces are a useful tool in fulfilling the heat sink requirements for a microcircuit element. Heat transfer is very effective in the boiling mode and this thesis focuses on the analysis of a spine-shaped extended surface in a boiling liquid. Because the heat transfer in the spine and the propagation of signals on a transmission line are governed by identical differential equations, an analysis procedure based on the cascading of electrical transmission lines is used to predict the performance of the spine. The result of the analysis is a computer program that can assist the circuit designer in meeting any heat transfer requirements. Spine; Fin; Extended Surface, Heat Sink.
Document Details
- Document Type
- Technical Report
- Publication Date
- Mar 01, 1992
- Accession Number
- ADA250045
Entities
People
- John W. Larkin
Organizations
- Naval Postgraduate School