RF Vacuum Electronics

Abstract

We summarize our second quarter progress and discuss third quarter plans for the development of an edge emitter based vacuum triode with performance goals of 10 micro A/micrometer emission current density at less than 250V and which can be modulated at 1 GHz for 1 hour. Design and layout of the emitter test mask was completed and fabrication of two process runs of edge emitter diodes were completed. These diode emitters utilize a comb emitter design where high resistivity TaN thin films act as current limiters to prevent edge burnout. Testing of these devices will start during the third quarter. Initial design work on the edge emitter triode was started and is described. Extensive finite element modeling (FEM) and analysis to aid in the triode design took place and is described. Significant process development also took place. Experimental studies of dielectrics such as sputtered SiO2, Si3N4 and PECVD SiO2 and Si3N4 were carried out to understand their leakage characteristics and, thus, understand their impact on emitter performance. A description of our vacuum test station is also given.

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Document Details

Document Type
Technical Report
Publication Date
Apr 08, 1992
Accession Number
ADA250379

Entities

People

  • D. Arch
  • J. Holmen
  • P. Bauhahn
  • T. Ohnstein
  • Tayo Akinande

Organizations

  • Honeywell International, Inc.

Tags

DTIC Thesaurus Topics

  • Ceramic Materials
  • Chemical Vapor Deposition
  • Current Density
  • Current Limiters
  • Dielectric Films
  • Dielectrics
  • Electrical Properties
  • Electronics
  • Elements
  • Emission
  • Fabrication
  • Films
  • Materials
  • Materials Processing
  • Microelectronics
  • Thin Films
  • Vacuum Electronics

Fields of Study

  • Physics

Readers

  • Electronics Engineering
  • Semiconductor Device Technology
  • Software Engineering

Technology Areas

  • Microelectronics
  • Microelectronics - Graphene
  • Microelectronics - Microelectromechanical Systems