Dynamic Solder Management

Abstract

Results from initial 2D steady-state isothermal simulations of wave soldering of DSM modified PCBs are presented. The effects of small (2mm) obstacles on solder flow paths can be clearly seen, more sophisticated, realistic models are under development and will be reported next quarter.

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Document Details

Document Type
Technical Report
Publication Date
Feb 01, 1992
Accession Number
ADA250564

Entities

People

  • G. Lindsay
  • M. Cummings

Tags

Communities of Interest

  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Boundary Layer
  • Computational Fluid Dynamics
  • Computer Programs
  • Computer Simulations
  • Computers
  • Contracts
  • Flow
  • Fluid Dynamics
  • Fluid Flow
  • Geometry
  • Heat Transfer
  • Simulations
  • Steady State
  • Surface Tension
  • Thermal Conductivity
  • Three Dimensional
  • Two Dimensional

Readers

  • Atmospheric Science / Meteorology, specifically Wind Wave Turbulence.
  • Computational Modeling and Simulation
  • Integrated Circuit Design and Technology.