Double-Sided Wafer Alignment Techniques

Abstract

A project was undertaken by the Harry Diamond Laboratories to develop a double-sided wafer alignment technique by which special-purpose devices could be fabricated using in-house equipment. The approach developed was inexpensive and did not require infrared alignment methods for viewing through the wafer. A double-sided alignment technique with two different accuracies was developed for use on an ordinary optical mask aligner. These methods were highly successful and are in active use today.

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Document Details

Document Type
Technical Report
Publication Date
Apr 01, 1992
Accession Number
ADA250757

Entities

People

  • Bruce R. Geil
  • Timothy J. Mermagen

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  • Harry Diamond Laboratories

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