Tunneling Acoustic Microscopy.

Abstract

We have microfabricated an integrated 1 GHz ultrasonic transducer and sharp silicon tip for use as a scanning near-field acoustic microscope probe. The silicon tip, which has a 500 A radius of curvature, is microfabricated using a batch fabrication process compatible with integrated circuit manufacturing techniques. The ZnO ultrasonic transducer is integrally fabricated at the base of the tip to allow sound waves to be transmitted longitudinally down the tip. The microscope is configured such that the tip is brought into close proximity of a sample which has a receiving acoustic transducer. Two-dimensional imaging is accomplished by raster scanning the tip over the sample while feeding back on the total transmitted acoustic power to keep the tip/sample separation constant.

Document Details

Document Type
Technical Report
Publication Date
May 01, 1992
Accession Number
ADA251028

Entities

People

  • B. T. Khuri-yakub
  • Calvin Quate

Organizations

  • Stanford University

Tags

Communities of Interest

  • Advanced Electronics
  • Materials and Manufacturing Processes

DTIC Thesaurus Topics

  • Acoustic Microscopes
  • Acoustic Propagation
  • Fabrication
  • Geometry
  • Integrated Circuits
  • Manufacturing
  • Microscopes
  • Microscopy
  • Near Field
  • Scanning
  • Semiconductor Manufacturing
  • Sound Waves
  • Transducers
  • Two Dimensional

Fields of Study

  • Physics

Readers

  • Aerodynamics.
  • Electromagnetic Wave Scattering and Antenna Radiation Engineering
  • Integrated Circuit Design and Technology.