Multilayer Actuator Products in Japan

Abstract

It has been a decade since cofired multilayer piezoelectric ceramic actuators became a commercial item in Japan led by the effort at NEC. Tokin Corp. since then has purchased the license from NEC to produce the same type actuators. The PI spent six months (Oct. 1991-March 1991) at Tokin Corp. R and D Lab in Sendai to study multilayer actuator development and reliability issues. Multilayer actuators can be divided largely into two categories: one is a stack type, in which sintered disks are stacked with an alternate electrode in between each ceramic disk, and the other is a cofired type. There are various structures within the cofired multilayer actuators: (A) ceramic multilayer capacitor (MLC) type, (B) plate-through with application of insulator at alternate electrodes, and (C) slits or gaps with MLC structure type. Each type has its own advantages and disadvantages, which are summarized in this report. A new structure actuator which does not belong to above categories, a three-dimensional interdigital electrode structure (3D-IDE), is being developed at Tokin Research Lab. The number of fine electrode lines controls the multiplication of piezoelectric effect, and multilayering is performed perpendicular to the displacement direction. Preliminary test results indicate that the 3D-IDE provides improved reliability compared with commercial plate-through type multilayer actuators.

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Document Details

Document Type
Technical Report
Publication Date
Jun 01, 1992
Accession Number
ADA251617

Entities

People

  • Shoko Yoshikawa

Organizations

  • Pennsylvania State University

Tags

Communities of Interest

  • Energy and Power Technologies
  • Sensors

DTIC Thesaurus Topics

  • Actuators
  • Capacitors
  • Ceramic Capacitors
  • Ceramic Materials
  • Coordinate Systems
  • Dielectrics
  • Displacement
  • Electric Fields
  • Failure Mode And Effect Analysis
  • Materials
  • Materials Laboratories
  • Mechanical Properties
  • Military Research
  • Piezoelectric Effect
  • Reliability
  • Stresses
  • Three Dimensional

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