Non-Destructive Characterization of Polyimide/Copper and Polyimide/Gold Interphases Using Surface-Enhanced Raman Scattering and Reflection-Absorption Infrared Spectroscopy
Abstract
The molecular structure of interfaces formed by curing the polyamic acid of pyromellitic dianhydride (PMDA) and oxydianiline (ODA) against copper and gold substrates was determined using surface-enhanced Raman scattering (SERS) and reflection-absorption infrared spectroscopy (RAIR). It was found that acid groups of the polyamic acid reacted with metal ions on the substrates to form carboxylate salts when the polyamic acid was spin coated onto metal substrates. Formation of carboxylates on the copper surface extended several hundred angstroms into the polyamic acid films, while only trace levels of carboxylates were formed on the gold surface. Formation of carboxylate salts suppressed the curing of polyamic acid on copper substrates. However, the degree of curing of the polyamic acid was high on gold surfaces. These results were compared to our previous work concerned with the molecular structure of interfaces between PMDA/ODA.
Document Details
- Document Type
- Technical Report
- Publication Date
- May 22, 1992
- Accession Number
- ADA251763
Entities
People
- F. James Boerio
- Joshua T. Young
Organizations
- University of Cincinnati