Multichip Module High Speed Testing

Abstract

May 1992 Research had continued on the characterization of polymers for high speed interconnection circuits in multi-chip modules. As an extension of our previous work on electro-optic response and sensitivity of poled side chain polymers, we have developed a new interferometric technique for measurements of the dielectric constant and loss over a frequency range from 10 GHz to over 3 THz. The method we used is an extension of the recently developed terahertz spectroscopy. It consists of the generation of a very short electrical pulse into free space, which is then transmitted through the polymer sample, passed through a Fourier transform interferometer, and detected in a bolometer. The source of short electrical pulses used is a p-i-n diode illuminated by a femtosecond optical pulse. We have previously shown that this technique is a very effective method of generating sub-picosecond electrical pulses in free space.

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Document Details

Document Type
Technical Report
Publication Date
May 01, 1992
Accession Number
ADA253364

Entities

People

  • David H. Auston

Organizations

  • Columbia University

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Dielectric Permittivity
  • Electrical Engineering
  • Engineering
  • Femtosecond Time
  • Films
  • Frequency
  • Frequency Response
  • Materials
  • Measurement
  • Multichip Modules
  • New York
  • Polymeric Films
  • Polymers
  • Students

Readers

  • Integrated Circuit Design and Technology.
  • Optical Physics and Photonics.
  • Spectroscopy.

Technology Areas

  • Space