Damage Modes and Mechanisms of Si-Ge Films under Prompt Soft X-Ray Radiation

Abstract

Thermal and residual stresses in films exposed to sudden temperature changes are analyzed based on an elastoplastic-brittle idealization of film response. The results thus obtained are used to explain qualitatively the damage mechanisms of various failure modes observed iii Si-Ge film deposited on a single crystal Si substrate exposed to soft x-ray radiation for a short duration of time.

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Document Details

Document Type
Technical Report
Publication Date
May 13, 1992
Accession Number
ADA253383

Entities

People

  • Dick J. Chang
  • Rokuro Muki
  • Sandra R. Gyetvay

Organizations

  • The Aerospace Corporation

Tags

Communities of Interest

  • Space

DTIC Thesaurus Topics

  • Air Force
  • Civil Engineering
  • Engineering
  • Materials
  • Mechanics
  • Radiation
  • Residual Stress
  • Residuals
  • Single Crystals
  • Soft X Rays
  • Stress Strain Relations
  • Stresses
  • Substrates
  • Surface Temperature
  • Temperature Gradients
  • Tensile Strength
  • X Rays

Fields of Study

  • Physics

Readers

  • Semiconductor Device Technology
  • Solar Physics
  • Structural Dynamics.