Design and Packaging of Fault Tolerant Optoelectronic Multiprocessor Computing Systems
Abstract
The goals for the project are primarily to develop the packaging technology, by integrating silicon CMOS chips, detectors, modulators, diffractive optical elements and/or photorefractive nonlinear crystals in a packagable design. On the secondary basis, we would model package systems and establish a data-base for CAD, and investigate the design of fault tolerant optoelectronic systems. The results of our investigation for this quarter are summarized below. We have been developing an approach for solving the alignment problem between microstructures on different sides of an optical substrate. This technique will allow us to build compound and complex optical systems for compact optoelectronic packages. The basic idea is to use fresnel lenses with the focal length equal to the thickness of the substrate to transfer positional information from one side of the substrate to the other.
Document Details
- Document Type
- Technical Report
- Publication Date
- Oct 14, 1991
- Accession Number
- ADA253465
Entities
People
- Sing H. Lee
Organizations
- University of California, San Diego