Design and Packaging of Fault Tolerant Optoelectronic Multiprocessor Computing Systems

Abstract

During this quarter, we continued our efforts on (1) studying alignment schemes for packaging and fabricating components for CMTM(Correlation Matrix Tensor Multiplier) packaging, (2) creating generalized e-beam fringe writing algorithms for automatically generating different types of HOEs for optical interconnects, and (3) design of switching elements in twin butterfly networks with parallel testing features built-in. The results are summarized below.

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Document Details

Document Type
Technical Report
Publication Date
Jan 14, 1992
Accession Number
ADA253466

Entities

People

  • Sing H. Lee

Organizations

  • University of California, San Diego

Tags

Communities of Interest

  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Accuracy
  • Algorithms
  • Detectors
  • Displacement
  • Fault Tolerance
  • Fresnel Lenses
  • Grain Size
  • Ion Beams
  • Lepidoptera
  • Light Sources
  • Misalignment
  • Optical Interconnects
  • Orientation (Direction)
  • Packaging
  • Power Supplies
  • Substrates
  • Switching

Fields of Study

  • Computer science
  • Physics

Readers

  • Integrated Circuit Design and Technology.
  • Optical Physics and Photonics.
  • Parallel and Distributed Computing.

Technology Areas

  • Microelectronics
  • Microelectronics - Microelectromechanical Systems