Development of 6H-SiC CMOS Transistors for Insertion into a 350 deg C Operational Amplifier

Abstract

Device parameter measurements have been made on n-channel MOSFET devices that were fabricated prior to this contract. These parameters were to be used to simulate circuits using Simulation Program with Integrated Circuit Emphasis (SPICE). The devices had I-V curves characteristic of normal MOSFETs. However, the gate leakage of these devices was too high to be allow meaningful data to be taken at very low drain biases. Therefore, the wafers currently in process must be finished, and must have sufficiently low gate leakage, before a significant modeling effort can be undertaken.

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Document Details

Document Type
Technical Report
Publication Date
Jul 22, 1992
Accession Number
ADA253760

Entities

People

  • John W. Palmour

Organizations

  • Wolfspeed

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Amplifiers
  • Ceramic Materials
  • Circuits
  • Compound Semiconductors
  • Contracts
  • Fabrication
  • Films
  • High Temperature
  • Integrated Circuits
  • Ion Implantation
  • Materials
  • Metal-Semiconductor Junctions
  • Operational Amplifiers
  • Silicon Carbide
  • Simulations
  • Thin Films
  • Transistors

Readers

  • Computational Modeling and Simulation
  • Integrated Circuit Design and Technology.
  • Semiconductor Device Technology