An Investigation of Residual Stresses in Machined Silicon Nitride

Abstract

An X-ray diffraction (XRD) residual stress investigation was conducted on groups of machined silicon nitride specimens utilizing copper K alpha radiation, the (323) 0-phase crystallographic planes and the sin2 psi stress-measuring technique. Cylindrical button-head tensile specimens formed by different processes and finish machined by different shops were characterized both before and after heat treatment. Surface machining stresses were also determined on a partial-machined tensile rod and on fractured flexure bars. The residual stress results are presented in the form of a comparative evaluation of processing parameters. Supplemental integrated intensity data from measurements on the partial-machined tensile rod and crushed buttonhead powder samples has demonstrated that XRD residual stress analysis may be applicable as a quality assurance procedure.

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Document Details

Document Type
Technical Report
Publication Date
Jul 01, 1992
Accession Number
ADA254635

Entities

People

  • Daniel J. Snoha
  • Michael R. Foley

Tags

Communities of Interest

  • Advanced Electronics
  • Air Platforms
  • Weapons Technologies

DTIC Thesaurus Topics

  • Air Force
  • Ceramic Materials
  • Diffraction
  • Elastic Properties
  • Engineering
  • Finishes
  • Heat Treatment
  • Materials
  • Materials Science
  • Materials Testing
  • Measurement
  • Mechanical Properties
  • Military Research
  • Modulus Of Elasticity
  • Stress Analysis
  • X Rays
  • X-Ray Diffraction

Readers

  • Materials Science and Engineering.
  • Mechanical Engineering/Mechanics of Materials.
  • Metallurgy