Multichip Module High Speed Testing
Abstract
In collaboration with Allied Signal Inc., have investigated the ultrafast electro-optic response and sensitivity of a poled side chain polymer film by a femtosecond electro-optic sampling technique. A 760 fs rise-time electrical transient was observed corresponding to a 460 GHz bandwidth. The measurement was made in a high speed coplanar transmission line structure using the electro-optic polymer as the dielectric. This result has important implications for the use of electro-optic polymers for probing signals in multi- chip module interconnection circuits. A paper describing this work (preprint enlcosed) has been accepted for publication in Applied Physics Letters. A second area of activity during the past quarter has been the establishment of a new experimental facility which will be used for the high speed testing of materials and devices for applications to multichip modules.
Document Details
- Document Type
- Technical Report
- Publication Date
- Sep 30, 1991
- Accession Number
- ADA254825
Entities
People
- David H. Auston
Organizations
- Columbia University