Hybrid Microcircuit Assembly Manufacturing Process Parameters Data List

Abstract

The Hybrid Microcircuit Assembly manufacturing process parameters have been established in order to bring about their recognition and control. The list is of generic thin film, thick film and multi-chip modules constructed with multi-layer green tape alumina and substrates. The list starts with substrate fabrication and progressing through to final assembly, inspection, and test. Once the parameters have been fully recognized and completely described, progress can be made in regulating the parameters. This regulation will bring about cost effective requirements and a higher quality product. Another benefit will come from knowing the parameters that need further scrutiny. The possible combining of manufacturing functions or techniques can in the future change the parameters but the new parameters can be compared with the old.

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Document Details

Document Type
Technical Report
Publication Date
Aug 01, 1992
Accession Number
ADA255096

Entities

Organizations

  • Naval Command, Control and Ocean Surveillance Center

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Application Protocols
  • Assembly
  • Circuit Boards
  • Circuits
  • Computer Science
  • Electronics
  • Fabrication
  • Films
  • Manufacturing
  • Materials
  • Microcircuits
  • Ocean Surveillance
  • Printed Circuits
  • Thick Films
  • Thin Films
  • Three Dimensional
  • Wear Resistance

Readers

  • Educational Psychology
  • Integrated Circuit Design and Technology.
  • Software Engineering

Technology Areas

  • Microelectronics
  • Microelectronics - Graphene