Natural Convection Heat Transfer Studies of Simulated and Actual Electronic Components Using Dielectric Liquids for Immersion Cooling
Abstract
Two experimental studies of the natural convection characteristics of heated protrusions immersed in dielectric liquids were conducted. The first study used a three by three array of simulated 20 pin dual-in-line chips which were made from aluminum blocks with foil heaters. The second set of experiments used a three by three array of thermal evaluation devices mounted on an alumina substrate. The devices were 8.9 mm square chips which contained resistors and a type of temperature sensing transistor. Both studies used an insulated Plexiglas enclosure with a top mounted heat exchanger maintained at a constant 10 deg C. Each array was mounted on a Plexiglas substrate, and spacers were used to vary the horizontal distance from the components to the enclosure wall. Five separate enclosure widths were used, with a maximum spacing of 40 mm. The vertically oriented aluminum blocks were tested with FC-71 and power levels ranging from 0. 115 W/chip to 2.9 W/chip. The non-dimensional data obtained was used to develop an empirical correlation which predicts Nusselt number as a function of Rayleigh number and enclosure width. The correlation was accurate to within 4% of the array averaged data, and the maximum uncertainty in the Nusselt number was 7.4%.
Document Details
- Document Type
- Technical Report
- Publication Date
- Jun 01, 1992
- Accession Number
- ADA255173
Entities
People
- Ronald G. Thompson Jr.
Organizations
- Naval Postgraduate School