Extended Surface Heat Sinks for Electronic Components: A Computer Optimization

Abstract

Heat sinks consisting of individual fins and arrays of fins are used extensively throughout the Navy and industry. The fins serve to increase the surface area through which heat is transferred to the surrounding environment by natural convection. Extended surfaces or fins are commonly found on electronic components ranging from power supplies to transformers. The dissipation and subsequent rejection of potentially destructive self produced heat is an important aspect of electronic equipment design. Fin design theory is examined starting with the optimization of individual fin dimensions. The insights obtained are utilized in an investigation of the optimal number and spacing of elements in an array of fins. The results are implemented in a computer program written in ADA and compiled for use on IBM compatible machines. The program takes as inputs thermal and physical data and outputs an optimized fin configuration.

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Document Details

Document Type
Technical Report
Publication Date
Jun 01, 1992
Accession Number
ADA256134

Entities

People

  • John R. Gensure

Organizations

  • Naval Postgraduate School

Tags

DTIC Thesaurus Topics

  • Computer Programs
  • Computers
  • Convection
  • Differential Equations
  • Electronic Components
  • Electronic Equipment
  • Engineering
  • Heat Energy
  • Heat Sinks
  • Heat Transfer
  • Heat Transfer Coefficients
  • Operating Systems
  • Schools
  • Temperature Gradients
  • Thermal Conductivity
  • United States Naval Academy
  • Word Processors

Readers

  • Electrical Engineering
  • Fluid Mechanics and Fluid Dynamics.
  • Systems Analysis and Design

Technology Areas

  • Microelectronics
  • Space
  • Space - Hall-Effect Thruster