B-2 Bomber: Logistics Cost Issues and Construction Planning
Abstract
The plan is to deliver the 0.25 um system in place and to demonstrate repair of both clear and opaque defects at that time. 75% of the subsystems designed for the 0.25 um Tool have been completed, tested and integrated. Four hardware systems are incomplete as of October 1992. These are gold deposition hardware, the differential laser interferometer, thermal isolation environment and the pattern generator electronics. The design of these subsystems has resulted from the interaction between IBM and Micrion under the March 16, 1992 Alliance and the DALP-Manassas contract under P.O. 286323. It is the intent to make both the government 0.25 um system and the IBM system the same, transferring the technology gained from the IBM interaction to the government 0. 25 um tool. Two software packages also need to be completed - these are support of the pattern generator and the ability to receive KLA 'Results', the second generation defect data transfer common to both UVIS and SEMSpec.
Document Details
- Document Type
- Technical Report
- Publication Date
- Dec 01, 1991
- Accession Number
- ADA256733
Entities
Organizations
- United States Government Accountability Office