Electronic Manufacturing Process Improvement (EMPI) for Printed Wiring Assemblies

Abstract

This Task 2 Technical Operating Report describes, in detail, the specific experiments that will be conducted under this contract on the integrated manufacturing process for surface mount technology (SMT) printed wiring assemblies (PWAs) at TRW MEAD. This detail includes: (1) The investigate methods used to design the experiments such as full- and fractional factorial techniques; (2) The printed wiring board (PWB) design, the component selection and layout, the defect data to be collected, and the inspection criteria used to collect the defect data; and (3) The applicable control limits and the tolerance budgets related to the integrated SMT PWA process flow.

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Document Details

Document Type
Technical Report
Publication Date
Apr 01, 1992
Accession Number
ADA256966

Entities

People

  • J. Murray
  • P. Crepeau
  • P. Glaser
  • T. Neillo

Tags

Communities of Interest

  • Autonomy
  • C4I
  • Cyber
  • Energy and Power Technologies
  • Human Systems
  • Sensors

DTIC Thesaurus Topics

  • Accuracy
  • Analysis Of Variance
  • Anti-Virus Software
  • Assembly
  • Contracts
  • Data Reduction
  • Engineering
  • Engineers
  • Experimental Data
  • Experimental Design
  • Fabrication
  • Factorial Design
  • Failure Mode And Effect Analysis
  • Inspection
  • Manufacturing
  • Measurement
  • Statistical Analysis

Readers

  • Aerospace Test and Evaluation
  • Computational Modeling and Simulation
  • Electrical Engineering

Technology Areas

  • Microelectronics
  • Microelectronics - Microelectromechanical Systems