Structure And Reliability Metal Contacts to GaAs.

Abstract

These results make it clear that any change in near-interfacial stoichiometry, e.g., by reaction of the metal overlayer with the substrate, will result in a change in barrier height and thus a change in the electrical performance of the device. Using electrical and microstructural characterization, we have investigated a wide range of metal/GaAs systems including the metals Ti, Al, Cr, Pd and Au. The Fermi level pinning position is found to relate directly to the amount of excess As near the interface: very As- rich GaAs results in pinning near midgap and thus a low barrier height for n- GaAs; less As-rich conditions result in pinning closer to the valence band and thus a high barrier height for n-GaAs. The observation was made by comparing near-interfacial stoichiometry of different metals with low and high barrier height, and by studying the change in near-interfacial stoichiometry upon annealing.

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Document Details

Document Type
Technical Report
Publication Date
Dec 31, 1991
Accession Number
ADA259184

Entities

People

  • Eicke R. Weber
  • Jack Washburn

Organizations

  • University of California, Berkeley

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Chemical Reactions
  • Chemistry
  • Compound Semiconductors
  • Diffraction
  • Electrical Properties
  • Electron Microscopy
  • Electronics Industry
  • Electronics Laboratories
  • Energy Bands
  • Engineering
  • Failure Mode And Effect Analysis
  • Field Effect Transistors
  • Materials Science
  • Metal-Semiconductor Junctions
  • Modules (Electronics)
  • Semiconductor Devices
  • Semiconductors

Fields of Study

  • Materials science

Readers

  • Semiconductor Device Technology