Applicability of Superconducting Interconnection Technology for High Speed ICs and Systems
Abstract
The extremely low-loss characteristics of HTSC interconnect renders it an attractive candidate for high density-high performance digital circuitry. The purpose of this program was to investigate these properties in detail, and to determine the characteristics of systems that can best exploit these properties. To this end a study was undertaken to more fully characterize the limitations of conventional interconnect, in particular in the context of source-terminated CMOS devices, a technology well-adapted to cryogenic applications. Thermal and mechanical considerations of HTSC-MCM technology were explored as well as part of this effort. Applying Rent's Rule to system connection requirements, it was determined that HTSC interconnects can significantly reduce the required levels of wiring and/or increase the packing density of conventionally partitioned IC's on an MCM. This advantage is amplified if IC's are first optimized for MCM application (eg. using larger numbers of area-I/O pads at the chip levels). Commercial applications of the technology were likewise explored, and it is believed that the development of conventional cryogenic-MCM optimization technology could prove to be a useful first step in the development of an appropriate HTSC-MCM infra-structure.
Document Details
- Document Type
- Technical Report
- Publication Date
- Oct 01, 1992
- Accession Number
- ADA259520