Formation of Defect-Free Metal/Semiconductor Contacts

Abstract

This program focused on the growth of metallic overlayers on semiconductor surfaces. Its goal was to investigate interface chemistry for a wide variety of metal-semiconductor systems and determine the growth structures produced by varying the metal and the processes of deposition. It was hoped that defect-free interfaces could be created by controlling the chemistry or the growth process itself. Indeed, a novel process involving cluster deposition was developed and shown to give interfaces that were free of conventional semiconductor defects. Throughout this program, we sought to use modern surface science techniques to investigate the chemical and physical properties of metal- semiconductor interfaces. Over a six year period, we were able to amass a large amount of information regarding semiconductor surface disruption induced by the growing metal overlayers, interface intermixing, and overlayer structures.

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Document Details

Document Type
Technical Report
Publication Date
Dec 15, 1992
Accession Number
ADA259604

Entities

People

  • John H. Weaver

Organizations

  • University of Minnesota

Tags

DTIC Thesaurus Topics

  • Advanced Materials
  • Chemical Engineering
  • Chemistry
  • Compound Semiconductors
  • Engineering
  • Fermi Levels
  • Materials
  • Materials Engineering
  • Materials Science
  • Military Research
  • Minority Groups
  • Physical Properties
  • Physics
  • Semiconductor Physics
  • Semiconductors
  • Solid State Physics
  • United States

Fields of Study

  • Materials science

Readers

  • Systems Analysis and Design
  • Thin Film Deposition Science.

Technology Areas

  • Microelectronics
  • Microelectronics - Graphene