Copper/Solder Intermetallic Growth Studies

Abstract

This document is a summary of initial findings from a series of experiments involving copper/solder intermetallic compounds (IMC's). Particularly the study examines the IMC's contribution to the changing physical properties of a solder joint as a function of time and temperature. In these experiments Cu/Sn joint samples were placed in the hot stage of an environmental scanning electron microscope, heated to about 170 deg C, and monitored for about 3 hr. A visual documentation of events is included in this report. A real-time videotape record of the IMC growth was produced as part of the work. Additionally a working hypothesis is presented that involves the relationship between IMC's and the mechanical properties of joints.

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Document Details

Document Type
Technical Report
Publication Date
Dec 01, 1992
Accession Number
ADA259856

Entities

People

  • George K. Lucey
  • James Geis
  • Kevin W. Kirchner

Organizations

  • United States Army Research Laboratory

Tags

Communities of Interest

  • Air Platforms

DTIC Thesaurus Topics

  • Conductivity
  • Controlled Atmospheres
  • Electrical Resistance
  • Electron Microscopes
  • Electrons
  • Heat Transfer
  • High Pressure
  • Hydroxides
  • Intermetallic Compounds
  • Joints
  • Mechanical Properties
  • Microscopes
  • Military Research
  • Physical Properties
  • Scanning Electron Microscopes
  • Thickness
  • X Rays

Readers

  • Business Analytics
  • Powder metallurgy of Titanium alloys.

Technology Areas

  • Microelectronics
  • Microelectronics - Graphene