Design and Packaging of Fault Tolerant Optoelectronic Multiprocessor Computing System

Abstract

During this quarter, we continued our research efforts on fabricating and testing packaged Correlation Matrix Tensor Multiplier module, developing a Computer Aided Design tool for solving PE placement problems in Oe-MCMs, and designing fault masking and reconfiguration of the twin butterfly interconnection network.

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Document Details

Document Type
Technical Report
Publication Date
Apr 14, 1992
Accession Number
ADA260051

Entities

People

  • Sing H. Lee

Organizations

  • University of California, San Diego

Tags

Communities of Interest

  • Air Platforms

DTIC Thesaurus Topics

  • Algorithms
  • Annealing
  • Computer Science
  • Computer Simulations
  • Computer-Aided Design
  • Detectors
  • Electron Beam Lithography
  • Electronics
  • Fabrication
  • Laser Diodes
  • Lasers
  • Lepidoptera
  • Light Sources
  • Optical Interconnects
  • Optoelectronic Devices
  • Optoelectronics
  • Reliability

Fields of Study

  • Physics

Readers

  • Integrated Circuit Design and Technology.
  • Parallel and Distributed Computing.

Technology Areas

  • Microelectronics
  • Microelectronics - Microelectromechanical Systems