Extruded Films From Modified Polypropylene Resin: Dielectric and Breakdown Studies

Abstract

Thin films (approximately 25 microns) formed by melt-extruding polypropylene resin after it had been briefly exposed to a low-pressure, low- temperature, CF4/02 gas plasma had significantly increased dielectric breakdown strengths with very-little accompanying changes in dielectric properties.

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Document Details

Document Type
Technical Report
Publication Date
Apr 01, 1992
Accession Number
ADA261382

Entities

People

  • Michael Binder
  • Robert J. Mammone
  • William L. Wade Jr.

Tags

Communities of Interest

  • Advanced Electronics
  • Weapons Technologies

DTIC Thesaurus Topics

  • Abstracts
  • Acquisition
  • Capacitors
  • Dielectric Films
  • Dielectric Permittivity
  • Dielectric Properties
  • Dielectrics
  • Films
  • Jet Propulsion
  • Low Temperature
  • Materials
  • Polymeric Films
  • Polymers
  • Polypropylene
  • Resins
  • Standards
  • Thin Films

Readers

  • Nanofabrication and Microfabrication.
  • Polymer Science and Engineering.
  • Pulsed Power and Plasma Physics.