Special Technology Area Review on Microwave Packaging Technology

Abstract

Microwave (MW) and millimeter wave (MMW) multichip module (MCM) packaging is an emerging technology that is of great importance for both defense and commercial applications. Military applications such as radar, electronic warfare, communications, and smart munitions and commercial applications such as communications, direct broadcast satellite, cellular telephone, and automotive electronics all require MW and/or MMW electronics. The spectrum of needs ranges from low volume, high performance electronics to high volume, low cost applications. A significant aspect of realizing these components and systems will be the development of a broad range of packaging and interconnect technologies that have the required reliability and environmental protection and are affordable and applicable to both the military and commercial sectors.

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Document Details

Document Type
Technical Report
Publication Date
Feb 01, 1993
Accession Number
ADA261852

Entities

People

  • Becky Terry

Tags

Communities of Interest

  • Advanced Electronics
  • Electronic Warfare
  • Human Systems
  • Space

DTIC Thesaurus Topics

  • Composite Materials
  • Databases
  • Electronics Industry
  • Integrated Circuits
  • Manufacturing
  • Materials
  • Metal Matrix Composites
  • Modules (Electronics)
  • Monolithic Microwave Integrated Circuits
  • Optical Materials
  • Precision-Guided Munitions
  • Semiconductors
  • Silicon Carbide
  • Test And Evaluation
  • Test Methods
  • Three Dimensional
  • Two Dimensional

Fields of Study

  • Engineering

Readers

  • Integrated Circuit Design and Technology.
  • Radio communications and signal processing.

Technology Areas

  • 5G
  • 5G - DoD 5G Program
  • 5G - Internet of Things
  • Microelectronics
  • Space