X-Ray Computed Tomography for Failure Analysis

Abstract

Under a preliminary testing task assignment of the Advanced Development of X-Ray Computed Tomography Application program, computed tomography (CT) has been studied for its potential as a tool to assist in failure analysis investigations. CT provides three-dimensional spatial distribution of material that can be used to assess internal configurations and material conditions nondestructively. This capability has been used in failure analysis studies to determine the position of internal components and their operation. CT is particularly advantageous on complex systems, composite failure studies, and testing under operational or environmental conditions. CT plays an important role in reducing the time and effort of a failure analysis investigation. Aircraft manufacturing or logistical facilities perform failure analysis operations routinely and could be expected to reduce schedules, reduce costs and/or improve evaluation on about 10 to 30 percent of the problems they investigate by using CT... Computed Tomography(CT), Failure analysis, Electromechanical System, Materials, Cost/benefit, Electronic, Honeycomb, Solenoid, Hydraulic, Nondestructive Evaluation(NDE).

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Document Details

Document Type
Technical Report
Publication Date
Aug 31, 1992
Accession Number
ADA261884

Entities

People

  • Alan R. Crews
  • Gary E. Georgeson
  • Richard H. Bossi

Organizations

  • Boeing Defense, Space & Security

Tags

Communities of Interest

  • Advanced Electronics
  • Biomedical
  • Space
  • Weapons Technologies

DTIC Thesaurus Topics

  • Acquisition
  • Aircrafts
  • Composite Materials
  • Electronic Components
  • Engineering
  • Epoxy Composites
  • Failure Mode And Effect Analysis
  • Graphite Epoxy Composites
  • Graphitic Materials
  • High Resolution
  • Materials Science
  • Measurement
  • Radiography
  • Three Dimensional
  • Tomography
  • Workload
  • X-Ray Computed Tomography

Readers

  • Electrical Engineering
  • Life Cycle Cost Analysis
  • Medical Imaging.

Technology Areas

  • Microelectronics