Electrochemical Behavior and Surface Chemistry of Aluminum Alloys: Solute-Rich Interphase Model
Abstract
The electrochemical behavior of physical-vapor-deposited nonequilibrium stainless Al-W and Al-Ta alloys and the electrochemical behavior and surface chemistry of sputter-deposited nonequilibrium stainless Al-Ta alloys have been investigated. Results from the vapor-deposited alloys show that these materials possess enhanced passivity despite the presence of nodules and other defects. The stainless aluminum alloys that exhibit better performance are the sputter-deposited thin films that more uniform. Sputter-deposited Al-Ta alloys exhibit enhanced passivity over a pH range of 2 to 12 even though the passive film chemistry varies considerably over this range. This enhanced passivity can be explained by the solute-rich interphase model (SRIM), which claims that formation and passivation of occluded cells are controlled by localized concentrations of solute. The higher concentrations of solute at the metal-oxide interface and around occluded cells stabilize the passive film from continued chloride attack and dissolution.
Document Details
- Document Type
- Technical Report
- Publication Date
- Mar 31, 1993
- Accession Number
- ADA262061
Entities
People
- A. S. Iyengart
- B. A. Shaw
- B. J. Rees
- C. A. Pecile
- E. L. Principe
- G. D. Davis
Organizations
- Martin Marietta