Department of Defense Advisory Group on Electron Devices. Special Technology Area Review on Microwave Packaging Technology. Appendix

Abstract

Electronic packaging is identified as an area providing opportunity for system performance enhancement for both defense and commercial applications. The move to microwave/millimeter wave multi-chip assemblies with high density interconnects is causing a significant shift in the current practices of how packages are being designed and manufactured. The longer term trend is to move to subsystem or multi-level packaging schemes to achieve higher levels of system integration. Packaging costs are being emphasized early in system developments. Workshop goals include the following: (1) Define packaging and interconnect technology and manufacturing problems/issues; (2) Recommend solutions to these problems by developing an investment strategy that can be used by government and industry; and (3) Build upon and couple to the 2-4 Mar 92 aged electronics packaging technology star.

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Document Details

Document Type
Technical Report
Publication Date
Feb 01, 1993
Accession Number
ADA262136

Entities

Organizations

  • Office Of The Under Secretary Of Defense

Tags

Communities of Interest

  • Advanced Electronics
  • Ground and Sea Platforms
  • Space

DTIC Thesaurus Topics

  • Aluminum Nitrides
  • Beam Steering
  • Ceramic Materials
  • Composite Materials
  • Databases
  • Electronics
  • Failure Mode And Effect Analysis
  • Manufacturing
  • Material Degradation Processes
  • Materials
  • Materials Laboratories
  • Materials Processing
  • Materials Science
  • Materials Testing
  • Metal Matrix Composites
  • Silicon Carbide
  • Three Dimensional

Readers

  • Academic Conference Management
  • Integrated Circuit Design and Technology.
  • Systems Analysis and Design

Technology Areas

  • 5G
  • 5G - DoD 5G Program
  • Microelectronics
  • Microelectronics - Microelectromechanical Systems